Research Trends in the Heat Transfer Simulation of Al₂O₃/AlN Granular Composites for Thermal Interface Materials

Abstract

Heat transfer simulation in granular Al₂O₃/AlN composites has become an increasingly relevant topic in the development of thermal interface materials (TIMs) for high-performance electronic systems. This study conducted a bibliometric analysis of 1,169 articles from the Scopus database published between 2015 and 2025 to identify research trends, frequently occurring keywords, geographic contributions, author and institutional impacts, and to outline future research opportunities in the development of TIMs based on Al₂O₃/AlN. The analysis was performed using RStudio, VOSviewer, and Excel, identifying five main thematic clusters: (1) AI and Neuroimaging for Brain Diseases; (2) TIM Applications and Thermal Optimization; (3) Molecular Simulation and Interface Properties; (4) AI and Brain Functional Connectivity; (5) Numerical Simulation of Material Thermal Properties and (6) Materials & Thermal Contact Resistance. The primary research focus includes numerical modeling of thermal conductivity, characterization of Al₂O₃ and AlN materials, and their initial applications in electronic cooling devices. While the scope remains limited at present, the annual growth in publications suggests that interest in this topic is likely to increase soon. This study provides an important initial overview of the research landscape. It opens up possibilities for future exploration, including the integration of multiscale approaches and enhanced experimental validation in heat transfer simulations involving granular composites.